Job Title: Sr. Packaging Engineer - Silicon Photonics
Job Location: New York, NY or San Francisco, CA
Compensation: $150K - $200K base Depending on experience plus stock options!
Requirements: Packaging, Opto-Mechanical Design, Fiber Attachment, Silicon Photonics, Precision Alignment
Our company is using photonics to realize scalable, high-bandwidth, energy-sustainable, and cost-effective solutions that enable the next generation of AI, ML, and simulation hardware.
Top Reasons to Work with Us
1) Competitive Compensation ($150K - $200K base Depending on Experience)
2) Comprehensive Benefits package including stock options!
3) The chance to join a small silicon photonics start-up tackling challenging problems with huge upside potential!
What You Will Be Doing
As a Sr. Packaging Engineer, you will contribute to the development of groundbreaking silicon photonics technology, enabling high-speed data communication and optical sensing applications. Your expertise in optomechanical design and precise fiber attachment will be instrumental in achieving our company's mission and success in the photonics industry.
- Optomechanical Design: Collaborate with the engineering team to design and develop optomechanical components, modules, and assemblies for silicon photonics devices. This includes mounting, alignment, and packaging of optical elements.
- Fiber Attachment: Develop and optimize techniques for attaching optical fibers to silicon photonics devices, ensuring high coupling efficiency and reliability in fiber-to-chip connections.
- Precision Alignment: Implement precision alignment and assembly techniques to achieve optimal optical performance. This may include active and passive alignment methods.
- Design for Manufacturability: Consider design aspects that facilitate cost-effective manufacturing processes and scalability for mass production.
- Material Selection: Evaluate and select materials for optomechanical components and fiber attachment, considering factors such as thermal stability, thermal expansion, and optical properties.
- Tolerance Analysis: Perform tolerance analysis to ensure that optomechanical components and fiber attachments meet specified performance criteria under various environmental conditions.
- Testing and Validation: Plan and execute tests to validate optomechanical designs and fiber attachment methods, ensuring they meet performance and reliability standards.
- Documentation: Maintain comprehensive documentation, including design specifications, reports, and assembly procedures, to facilitate clear communication with cross-functional teams and manufacturing partners.
- Collaboration: Work closely with optical engineers, semiconductor engineers, and manufacturing teams to integrate optomechanical and fiber-attach solutions seamlessly into silicon photonics systems.
What You Need for this Position
Bachelor's Degree (MS or PhD Preferred) in Mechanical Engineering, Optical Engineering, or similar with 5+ years experience with the following:
- Packaging, Optomechanical Design, fiber attachment, and precision alignment, particularly in the context of silicon photonics.
- CAD software for mechanical design
- Strong analytical skills, including tolerance analysis and finite element analysis (FEA).
- Familiarity with optical fibers, connectors, and alignment methods.
- Knowledge of material properties relevant to optomechanical design.
- Ability to work in a dynamic, cross-functional startup environment.
- Knowledge of semiconductor manufacturing processes and cleanroom protocols is a plus.
So, if you are a Sr. Packaging Engineer with Silicon Photonics experience, please apply today! or send an updated copy of your resume to Mike.Vandenbergh@CyberCoders.com for immediate consideration!
Applicants must be authorized to work in the U.S.